Design of High Quality Factor Spiral Inductors in RF MCM-D
نویسندگان
چکیده
This thesis studies the design and fabrication of spiral inductors for use in Radio Frequency (RF) applications. A design methodology is developed to search an inductor design space efficiently using existing simulation software. The methodology allows designers to specify a desired inductance, total area, and frequency of operation instead of the geometrical parameters required by most design software. An implementation of the methodology that finds devices with optimal quality factor at a given frequency is presented. Several inductor designs are generated using this implementation, and the devices are fabricated in the Draper Laboratory, Inc. Multichip Module-Deposited (MCM-D) process. Simulated characteristics of the devices are verified using experimental measurements, and deviations from predicted performance are discussed. Thesis Supervisor: Luca Daniel Title: Assistant Professor of Electrical Engineering and Computer Science Thesis Supervisor: Thomas Marinis Title: Principal Member of Technical Staff, Charles Stark Draper Laboratory
منابع مشابه
Experimental Analysis of Design Options for Spiral Inductors Integrated on Low Cost MCM-D Substrates
This paper presents the results of investigations on integrated inductors for a new low cost MCM-D substrate technology. The results are focused on the analysis of design options and design parameter for planar spiral inductors. Measurements on test structures were used to quantify process tolerances and inductor performance and to set up accurate models for em-simulations. Simulation results o...
متن کاملIntegrated Passive Elements on Low Cost MCM-D Substrates
Next generation wireless communiaction terminals will demand the use of advanced component integration process and high density packaging technologies in order to reduce size and to increase performance. The ability of the MCM-D low-cost Large Area Panel Processing technology to provide controlled impedance, microstrip, coplanar structures and integrated thin film passive components with useful...
متن کاملChip-Package Co-Design of a 4.7 GHz VCO
Future wireless communication applications require low-power and highly integrated transceiver solutions. The integration of the RF front-end poses a great challenge, in particular, as traditional implementations require a large number of external passive components. “Single-package” integration of complete transceivers based on an MCM-D technology with integrated passives is presented in this ...
متن کاملSynthesis of On-Chip Square Spiral Inductors for RFIC’s using Artificial Neural Network Toolbox and Particle Swarm Optimization
In this paper on-chip square spiral inductors are designed using ANN modeling techniques. Layout geometries form the input of the ANN model and electrical quantities forms the output . The dependency of inductor performances such as inductance (L), quality factor (Q) and self-resonance frequency (SRF) on geometric dimensions are described. Spirals of wide range of RF applications are studied. I...
متن کاملDesign and Fabrication of High-Q Spiral Inductors Using MEMS Technology
This paper presents the design and modeling, fabrication and characterization of suspended spiral inductors on silicon substrate. The substrate materials underneath the inductor coil are removed by micromachining process to reduce the substrate loss which enables high frequency operation. A complete Library of spiral inductors with different line width, line spacing and number of turns have bee...
متن کامل